EDA Tutorial:Chip Mounting and Printed Circuit Board / Hybrid Design

Chip Mounting and Printed Circuit Board / Hybrid Design

To analyse the working of the chip samples, some manufactured dies were mounted in JEDEC CLCC44 packages. The bonding plan fig. 26.17 has to be defined for that.EDA Tutorial-0183

The bonding plan defines the pins of the package. To use and test the chip an external circuit with LEDs, button, and some passive components is needed. This external circuit was designed in SMD technology on a printed circuit board of the size of a chip card fig. 26.18. The EDA tools used will not be described further here. A second variant of the dice was mounted on a thick film hybrid substrate, made in a process available at the University of Applied Sciences Offenburg. It has to be mentioned that the whole design and all process steps including the hybrid processes were made by students in projects at the above school [26.1], [26.2], and are now part of the actual engineering curriculum in Offenburg/Germany.

EDA Tutorial-0184

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